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Taiwanese semiconductor maker MediaTek has launched the Dimensity 9400 chipset, bringing improved performance across the board.
Notably, the new-generation flagship chip enhances on-device artificial intelligence capabilities and supports tri-fold smartphones.
Based on TSMC’s second-generation 3nm process, the Dimensity 9400 chip is up to 40 per cent more power efficient than its predecessor, MediaTek stated.
The company also indicated that the first smartphones powered by the MediaTek Dimensity 9400 chip will be available in the fourth quarter of 2024.
The MediaTek Dimensity 9400 chip has adopted the company’s second-generation All Big Core Design, based on Arm’s v9.2 CPU architecture.
The chip features a single Arm Cortex-X925 core operating at a clock speed of over 3.62GHz, coupled with three Cortex-X4 cores and four Cortex-A720 cores.
MediaTek claimed that this design offers 35 per cent faster single-core performance and 28 per cent faster multi-core performance compared to the last generation Dimensity 9300 chip.
Regarding the dedicated graphics processing unit (GPU), MediaTek stated that the new chip provides up to 40 per cent better ray tracing performance than the previous generation.
Ray tracing simulates how light behaves in real life to enhance graphics, especially in games.
The chipset’s ray tracing capabilities are further improved by the inclusion of opacity micromaps (OMM) support, which allows for more detailed light tracing in visually dense scenes, such as those with extensive vegetation.
The GPU on the Dimensity 9400 also offers a 41 per cent performance boost while saving 44 per cent more power compared to the last generation chip.