Gujarat government signs MoU with American chipmaker firm Micron Technology for semiconductor assembly and test facility in Ahmedabad
The MoU was signed at Gandhinagar in the presence of Chief Minister Bhupendra Patel and Union Electronics and IT Minister Ashwini Vaishnaw
The Gujarat government today signed an MoU with American chipmaker firm Micron Technology for a semiconductor assembly and test facility at Sanand in Ahmedabad district.
The MoU was signed at Gandhinagar in the presence of Chief Minister Bhupendra Patel and Union Electronics and IT Minister Ashwini Vaishnaw.
Under the scheme, the Central Government will provide 50 percent fiscal support for the total project cost to the US-based firm while the state government will provide incentives representing 20 percent of the total.
The semiconductor assembly and test plant is expected to create five thousand direct employment opportunities in the State.
According to the official release, Phase 1 of the plant will become operational by the end of 2024.
